We are a Technical Sales Firm with a consultative approach toward selling. The majority of our customer visits are with Engineering Staff, including Designers, Systems Engineers, and Support Engineering. Regardless of the design requirements, such as standard off-the shelf components, custom components, or complex sub-assemblies, Arcadia's team will assist you in identifying and providing technical solutions for your project, and will exceed your support expectations through the life of your program.
Arcadia Technical Sales, L.L.C. is a professional Manufacturer’s Representative organization which was established in 1998 by Brad Cady who, prior to Arcadia held a Principal position with a major Mil-Aero Arizona Rep firm for 14 years.
Our professional sales team offers extensive experience in both direct sales and as Manufacturer's Representatives, enabling us to achieve high levels of success in major markets within the territory.
We support various applications, including Military, Aerospace, Space, Telecom, Medical, and Industrial. Arcadia's product breadth, as evidenced by our Principal listing, enables us to service all of these markets with a strong emphasis on high reliability products.
Data Bus Components, Modules and Boards. Solid State Power Controllers. DC Brushless Motor Control & Drive. Aerospace / Military / Space Magnetics. Signal, Power, Switchmode IAW Mil-Std-1553, Mil-PRF-27, Mil-Std-981
Standard and custom board to board, microD, nano, RF connectors, and cable assemblies
Conical inductors, ferrite beads, space level fuses, broadband capacitors, attenuators and resistors
Complex PCB's up to 50 layers, Specializing in RF/MW, 24 hour turn time, prototype runs, controlled impedance
LDMOS & GaN based transistors for RF Power, Pallets, and MCM’s. LNA's, Power Amplifiers, Filters, Couplers, Antennas, Mixers, CRO/DRO’s, RF Hybrids & IMA's. Detectors, Terminations, & Power Dividers (DC-67 GHz)
Tin Whisker Mitigation (TWM) by adding lead (Pb) to chip size components with pure tin (Sn) terminals. AEM Sn-Pb conversion process is NOT a hot solder dip operation that introduces the risk of thermal shock to the components